型　  号：SENTECH SE 850 DUV

  功　  能：

• 薄膜厚度及光学常数的测量
  Uniform spin coating for various photoresists
• 适用于4吋基片及各种碎片
  From pieces up to 4 - inch wafers

  主要指标：

• 光谱范围(Spectral Range)：190 ~ 2500 nm
• 光谱分辨率(Spectral resolution)：DUV-VIS: Better than 0.8 nm per pixel, NIR: 32 cm^-1 ~ 1 cm^-1
• 样品尺寸(Sample size)：up to 6 inches
• 最大样品厚度(Maximum substrate thickness)：7 mm
• 基片形态(Substrate)：opaque or transparent
• 测量时间(Measurement time)：UV/VIS: minimum time for full ψ/Δ spectra from a sample is about 5 s, NIR: minimal 30 s, typical 120 s

• 光斑尺寸(Measurement spot size)：Manually variable beam diameter from 0.1 mm to 4 mm

  技术特点：

• 测量速度快，分辨率高，信噪比好
  High measurement speedw ith high resolution and high S/N ratio
• 厚度的面分布测量
  Thickness mapping capability